Fundamentals of III-V Semiconductor MOSFETs

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Serge Oktyabrsky, Peide Ye
Springer Science & Business Media, 16/03/2010 - 445 páginas

Fundamentals of III-V Semiconductor MOSFETs presents the fundamentals and current status of research of compound semiconductor metal-oxide-semiconductor field-effect transistors (MOSFETs) that are envisioned as a future replacement of silicon in digital circuits. The material covered begins with a review of specific properties of III-V semiconductors and available technologies making them attractive to MOSFET technology, such as band-engineered heterostructures, effect of strain, nanoscale control during epitaxial growth. Due to the lack of thermodynamically stable native oxides on III-V's (such as SiO2 on Si), high-k oxides are the natural choice of dielectrics for III-V MOSFETs. The key challenge of the III-V MOSFET technology is a high-quality, thermodynamically stable gate dielectric that passivates the interface states, similar to SiO2 on Si. Several chapters give a detailed description of materials science and electronic behavior of various dielectrics and related interfaces, as well as physics of fabricated devices and MOSFET fabrication technologies. Topics also include recent progress and understanding of various materials systems; specific issues for electrical measurement of gate stacks and FETs with low and wide bandgap channels and high interface trap density; possible paths of integration of different semiconductor materials on Si platform.

 

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Índice

86 Summary
237
InGaAs Ge and GaN MetalOxideSemiconductor Devices with Highk Dielectrics for Science and Technology Beyond Si CMOS
251
92 Material Growth Device Fabrication and Measurement
253
93 Devices
255
94 Interfacial Chemical Properties
266
95 EnergyBand Parameters
268
96 Thickness Scalability of Ga2O3Gd2O3 on InGaAs with Low Dit Low Leakage Currents and HighTemperature Thermodynamic Stability
272
97 Interface Trap Densities and Efficiency of FermiLevel Movement
274

25 Strained IIIV for pMOSFETs
22
26 Novel Device Structure and Parasitics
24
27 Conclusion
27
Device Physics and Performance Potential of IIIV FieldEffect Transistors
31
32 InGaAs HEMTs
32
33 Discussion
36
34 Conclusions
46
Theory of HfO2Based Highk Dielectric Gate Stacks
51
42 Theoretical Background
52
43 Properties of Bulk Hafnia and Zirconia
57
44 Surfaces
71
45 Band Alignment at Hafnia Interfaces
81
46 Conclusions
89
Density Functional Theory Simulations of Highk Oxides on IIIV Semiconductors
93
52 Methodology of DFT Simulations of Highk Oxides on Semiconductor Substrates
96
53 DFT Simulations of Highk Oxides on SiGe Substrates
106
54 Generation of Amorphous Highk Oxide Samples by Hybrid ClassicalDFT Molecular Dynamics Computer Simulations
112
55 The Current Progress in DFT Simulations of Highk OxideIIIV Semiconductor Stacks
118
56 Summary
126
Interfacial Chemistry of Oxides on IIIV Compound Semiconductors
131
62 Surfaces of IIIV MOSFET Semiconductor Candidates
132
63 Oxide Formation Native and Thermal
138
64 Oxide Deposition on IIIV Substrates
146
65 Electrical Behavior of Oxides on IIIV and Interfacial Chemistry
156
66 Conclusions
165
AtomicLayer Deposited HighkIIIV MetalOxideSemiconductor Devices and Correlated Empirical Model
173
72 History and Current Status
174
73 Empirical Model for IIIV MOS Interfaces
178
74 Experiments on HighkIIIV MOSFETs
181
75 Conclusion
188
Materials and Technologies for IIIV MOSFETs
195
82 IIIV HEMTs for Digital Applications
196
83 Challenges for IIIV MOSFETs
207
84 Mobility in Buried Quantum Well Channel
208
85 Interface Passivation Technologies
210
98 Conclusion
279
Sub100 nm Gate IIIV MOSFET for Digital Applications
285
102 MOSFET Figures of Merit for Digital Applications
286
103 Selection of IIIV Channel Materials
290
104 SelfAligned IIIV MOSFET Structures
294
105 Benchmark of IIIV FET with Si CMOS
299
106 Outlook and Conclusions
302
Electrical and Material Characteristics of Hafnium Oxide with Silicon Interface Passivation on IIIV Substrate for Future Scaled CMOS Technology
307
112 MOSCAPs and MOSFETs on GaAs with Si SiGe Interface Passivation Layer IPL
309
113 MOSCAPs and MOSFETs on InGaAs with Si IPL
334
114 MOSCAPs and SelfAligned nchannel MOSFETs on InP Channel Materials with Si IPL
342
115 Conclusions
346
ptype Channel FieldEffect Transistors
349
122 LowField Hole Mobility in Bulk Semiconductors
351
Figures of Merit with Scaling of Channel Length
353
124 Strained Quantum Wells
355
125 pchannel HFETs
364
126 ptype MOSFETs
370
127 Conclusions
372
Insulated Gate NitrideBased Field Effect Transistors
379
132 Materials Growth and Deposition Technologies
381
133 Transport Properties
389
134 Device Design and Fabrication
395
135 Device Characteristics
397
136 NonIdeal Effects and Reliability
404
137 Applications and Performance
406
From Megawatts to Terahertz
414
References
416
TechnologyCircuit CoDesign for IIIV FETs
423
142 DeviceSpice Models
425
143 Logic Circuit Analysis
428
144 Memory Circuit Analysis
435
145 Application Space of InSb QWFETs
439
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