High-Frequency Integrated Circuits

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Cambridge University Press, 28/02/2013 - 902 páginas
A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.
 

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Introduction
1
Highfrequency and highdatarate communication systems
14
Highfrequency linear noisy network analysis
77
Highfrequency devices
142
Circuit analysis techniques for highfrequency integrated circuits
318
Tuned power amplifier design
374
Lownoise tuned amplifier design
439
Broadband lownoise and transimpedance amplifiers
503
Mixers switches modulators and other control circuits
553
Design of voltagecontrolled oscillators
621
Highspeed digital logic
698
Highspeed digital output drivers with waveshape control
756
SoC examples
803
Trigonometric identities
851
Index
892
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Sorin Voinigescu is a Professor at the University of Toronto, where his research and teaching interests focus on nano-scale semiconductor devices and their application in integrated circuits at frequencies beyond 300 GHz. The co-founder of Quake Technologies, Inc., he was a recipient of the Best Paper Award at the 2001 IEEE Custom Integrated Circuits Conference, 2005 IEEE Compound Semiconductor IC Symposium (CSICS) and of the Beatrice Winner Award at the 2008 IEEE International Solid State Circuits Conference (ISSCC). His students have won Student Paper Awards at the 2004 VLSI Circuits Symposium, the 2006 RFIC Symposium and at the 2008 International Microwave Symposium.

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